MicroMod_Processor_Board

(module LED-0603 (layer F.Cu) (tedit 0)
  (descr "<B>LED 0603 SMT</B><p>\n0603, surface mount.\n<p>Specifications:\n<ul><li>Pin count: 2</li>\n<li>Pin pitch:0.075inch </li>\n<li>Area: 0.06\" x 0.03\"</li>\n</ul></p>\n<p>Example device(s):\n<ul><li>LED - BLUE</li>")
  (fp_text reference D4 (at 0 -0.635) (layer F.SilkS)
    (effects (font (size 0.57912 0.57912) (thickness 0.115824)) (justify bottom))
  )
  (fp_text value BLUE (at 0 0.635) (layer F.Fab)
    (effects (font (size 0.57912 0.57912) (thickness 0.115824)) (justify top))
  )
  (fp_line (start 1.5875 -0.47625) (end 1.5875 0.47625) (layer F.SilkS) (width 0.2032))
  (fp_line (start 0.15875 -0.47625) (end 0.15875 0) (layer F.Fab) (width 0.127))
  (fp_line (start 0.15875 0) (end 0.15875 0.47625) (layer F.Fab) (width 0.127))
  (fp_line (start 0.15875 0) (end -0.15875 -0.3175) (layer F.Fab) (width 0.127))
  (fp_line (start 0.15875 0) (end -0.15875 0.3175) (layer F.Fab) (width 0.127))
  (pad C smd roundrect (at 0.877 0 270) (size 1 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15)
    (solder_mask_margin 0.1016))
  (pad A smd roundrect (at -0.877 0 270) (size 1 1) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.15)
    (solder_mask_margin 0.1016))
)