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VLF4r2

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VLF4_PCB assembly79 child itemsPCBA

PCB schematics and layout for Void Lake Fusion 4 Avionics

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About

PCB schematics and layout for Void Lake Fusion 4 Avionics

Electronics

License not specified

Build details

Difficulty: Intermediate
Parts estimate: $0 USD
Build time: ~1 hours

Estimates supplied with this release.

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Command line

git lfs install
git clone https://thingatlas.com/git/-unclaimed/vlf4r2-729602622.git

Includes Git history, branches, and Git LFS files. Clones the repository’s default branch, regardless of the version shown here.

README.mdView source

Void Lake Fusion 4 (VLF4)

SRAD Avionics from the McMaster Rocketry Team

README image

README image

Our Avionics Museum

Selling point

Pyro short circuit protection
Molex nano-fit connectors
1W LoRa, 100km+ LoS range
GPS + IMU + baro sensor fusion, reducing the chance of ejecting prematurely
Modern 3D visualizer
Small
Open source firmware
Relatively cheap

Pyro

3 pyro channels, each 8A continuous (current limited by the connector due to size)
pyro channels not connected to battery+ when not firing (unlike raven)
continuity detection
short circuit protection

Sensors

MCU: STM32H723
IMU 1: ±2000deg/s ±16g (LSM6DSMTR)
IMU 2: ±100g (H3LIS100DLTR)
Magnetometer: MMC5603NJ
Barometer: max altitude 30km (MS5607)
Storage: 64MB NOR Flash (W25Q512JVFIQ)
GPS: L80RE-M37
Radio: 1W LoRa (e22-900m30s)

Connectivity

2 buzzers for stereo sound
usb type-c
battery: 2 pin molex nano-fit
power & arming switch: 4 pin molex nano-fit (no large current is carried over switches)
pyro: 6 pin molex nano-fit
extension: 8 pin molex nano-fit:
- ground: 1 pin
- power out (battery voltage) (only provides power out if the power switch is turned on): 1 pin
- serial: 2 pins
- CAN: 2 pins
- GPIO: 2 pins
Serial Wire Debug: 5 pin molex pico-clasp
SMA antenna connector

Software (WIP, to be open sourced)

Async embedded rust

JLCPCB Manufacturing Specifications

Base Material: FR-4
Layers: 6
PCB Thickness: 1.6
Impedance Control: yes JLC06161H-3313
PCB Color: Black
Silkscreen: White
Material Type: FR-4 TG155
Via Covering: Epoxy Filled & Capped
Surface Finish: ENIG
Gold Thickness: 1 U"
Deburring/Edge rounding: No
Outer Copper Weight: 1 oz
Inner Copper Weight: 0.5 oz
Gold Fingers: No
Flying Probe Test: Fully Test
Castellated Holes: no
Remove Order Number: Specify a location
Min via hole size/diameter: 0.2mm/(0.3/0.35mm)
4-Wire Kelvin Test: Yes
Paper between PCBs: No
Appearance Quality: IPC Class 2 Standard
Confirm Production file: Yes
Silkscreen Technology: Ink-jet/Screen Printing Silkscreen
X-out board: Accept
Package Box: With JLCPCB logo
Board Outline Tolerance: ±0.2mm(Regular)