Loading files
This file is pinned to the selected release. Download the original to open it in your design tool.
43d1efe01This file is pinned to the selected release. Download the original to open it in your design tool.
X-Band T/R Module (10 GHz) with Fractal Antenna
High-performance single-channel Transmit/Receive (T/R) module for X-band phased array systems (~10–10.5 GHz), featuring integrated beamforming and a compact fractal antenna.
---------------------------------
<img width="342" height="679" alt="TR_Module_10GHz kicad" src="https://github.com/user-attachments/assets/77c6f4d4-0f27-47eb-a78c-3ea46b9e804b" />
---------------------------------
High-performance single-channel Transmit/Receive (T/R) module for X-band phased array systems (~10–10.5 GHz), featuring integrated beamforming and a compact fractal antenna.
⸻
Overview
This project implements a single RF front-end module (tile) designed for scalable phased array systems.
Key features:
• X-band operation (~10–10.5 GHz)
• Integrated PA + LNA + T/R switch (QPM1002)
• Beamforming support (phase + amplitude control)
• Compact fractal antenna (14×14 mm)
• Designed for array scaling (e.g., 256+ elements)
• Optimized for automated routing (Freerouting)
⸻
Architecture
RF IN → Phase Shifter → Attenuator → TXIN → [QPM1002] → ANT → Antenna
▲
RF OUT ← Phase Shifter ← Attenuator ← RXOUT ┘
QPM1002 Internal Structure:
• TX path: PA (~35 dBm pulsed)
• RX path: LNA (~2.2 dB NF, ~25 dB gain)
• Internal T/R switch
• Built-in power detector (VDET)
⸻
Power Architecture
Rail Voltage Purpose
TX_VD +25V Power Amplifier
RX_VD +10V LNA
VDD_LOGIC +5V Digital logic
VDD_IO +3.3V Control interface
VG -2.5V GaN gate bias
Converters:
• LM5156 (SEPIC) → 25V
• LM5017 → 10V / 5V
• Charge pump → -2.5V
⸻
RF Components
Component Function Notes
QPM1002 T/R front-end Core RF IC
TGP2109 Phase shifter (6-bit) 8–12 GHz
PE43705 Attenuator (6-bit) 0.5–12 GHz
⸻
PCB
• Substrate: Rogers 4350B
• Stackup: 4 layers (RF + GND + PWR + CTRL)
• Controlled impedance (50 Ω)
• Dense via stitching for RF grounding
• Optimized for high-frequency layout
⸻
Thermal Design
Per module dissipation:
Block Power
PA ~8 W
DC-DC ~5.5 W
Beamforming ~1.3 W
Other ~1 W
Total: ~16 W per module
For 256 modules:
• Total ≈ 4 kW
• Requires liquid cooling
⸻
Control Interface
• SPI (phase + attenuation control)
• GPIO (TX/RX switching)
• I²C (temperature sensors)
Logic:
• SN74HC595 (shift register)
• SN74LVTH573 (latch)
⸻
Monitoring
• 4× TMP117 temperature sensors:
• RF front-end
• Power stage
• Beamforming chain
• PCB ambient
⸻
Power Sequencing
Power-Up:
1. Apply VG (-2.5V)
2. Disable TX/RX
3. Enable RX_VD (10V)
4. Enable TX_VD (25V)
5. Enable TX/RX
Power-Down:
1. Disable TX/RX
2. Disable TX_VD
3. Disable RX