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Track width/spacing:
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Track thickness/clearance
Fab Min:
2-layer no BGAs: 5mil (0.127mm).
2-layer w/BGA: 4mil/4mil (0.102mm) e.g. STM32F722IEK
4-layer: 3.5mil (0.09mm) e.g. STM32MP153DAD
4-layer BGA fan-outs: Can do 3mil (Posin charges extra)
Pref:
6mil minimum (.15mm), 8mil if possible (0.2mm)
High current:
12mil if possible (0.3mm)
Posin:
- 0.09mm/0.09mm is OK (example: MetaModule p11)
- Don't know the minumum they will do but 0.073mm will cost extra (see email May 6, 2022)
JLCPCB:
From their Capabilities page:
- 2layer: 0.1mm/0.1mm min
- 4layer: 0.09mm/0.09mm min (verifed with mp153-devboard)
- 4layer: in BGA fan-outs 3mil (0.0762mm) is acceptable
BGA Pad diameter:
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**Summary:** Unknown... use 0.250 if possible?
Note: P0.5mm with 0.09mm track/space leaves 0.230mm pad
Posin:
- Don't know minimum, but 0.230mm has been done with MM board (P0.5mm)
- 0.28mm pad done with DLDs
JLCPCB:
- BGA pad diameter ≥ 0.25 mm (according to website)
- But 0.230mm has been done with mp153-devboard (P0.5mm) with no failures so far
- Same clearance of 0.1mm for 2layer, 0.09mm for 4layer
Vias
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**Summary:** Prefer 0.3mm hole, 0.6mm diameter. Drop to 0.3mm hole/0.5mm dia if needed. Min 0.15mm hole, 0.25mm diameter.
Need to use laser vias for 0.1mm.
Posin:
- Min. hole: 0.15mm through all layers
- Min. laser via 0.1mm hole between L1 and L2 (or L3 and L4)
JLCPCB:
- website recommends 0.3mm hole, 0.45m diameter
- charges more for 0.25mm hole, 0.4m diameter
- charges more for 0.2mm hole, 0.35m diameter
- charges more for 0.15mm hole, 0.3mm diameter, will go down to 0.25mm diameter
Vias-in-Pads:
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Posin:
- Can do laser holes on pad. We had lots of failures with a run of these DLDs.(0.28mm pad for P0.5mm, 0.1mm laser via to L2)
JLCPCB:
- from website: "Vias can be placed within BGA pads using filled and plated-over vias" 0.15mm-0.5mm
Silk legends:
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(Height/Width/Thickness)
Fab Min: 40mil(1mm) min height. 6mil (0.15mm) min line thickness
Pref: 0.040/0.040/0.006 = 1mm/1mm/.15mm
Min legible: 0.024/0.024/0.006 = 0.6mm/0.6mm/.15mm
Bigger and thicker is easier to read, if there’s room.
Distance from Edge Cut to pad or trace:
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Pref: 10mil
Distance between jack and LED w/light pipe
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(Center to Center):
345mil (8.76mm)
Height and Width of Eurorack PCB:
Height ideal: 4.3" (109.22mm)
Heigh max (if necessary): 4.365" (110.871mm)
Width ideal < width of faceplate (EnsOsc = 2.9mm shorter than faceplate)
Width max = width of faceplate
Minimum distance from edge of PCB to edge of faceplate: 0.347" (8.81mm)
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