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53b14b66Bare printed circuit board, before component assembly.
| Layer | Material | Thickness |
|---|---|---|
| Top surfaceSilkscreen · Color unspecified / Solder paste / Solder mask · Color unspecified | ||
| Copper | 0.035 mm≈ 1 oz/ft² | |
| FR4 | 0.1 mm | |
| Copper | 0.035 mm≈ 1 oz/ft² | |
| FR4 | 1.24 mm | |
| Copper | 0.035 mm≈ 1 oz/ft² | |
| FR4 | 0.1 mm | |
| Copper | 0.035 mm≈ 1 oz/ft² | |
| Bottom surfaceSolder mask · Color unspecified / Solder paste / Silkscreen · Color unspecified | ||
Sum of specified layer thicknesses. Unspecified coatings are excluded. Copper weight shown with ≈ is an estimate, not a saved requirement.
| Parent | Qty | References |
|---|---|---|
| 1 | — |
Source commit 53b14b66